Issue Date: December 18, 2006
Two recent advances in device fabrication could help move transistors off silicon wafers and onto flexible plastic substrates. There, they could be made into bendable electronic paper and skin-conforming sensors.
Although the reports describe the fabrication of very different devices—one combines dissimilar classes of semiconductors, and the other consists of large arrays of single-crystal organic transistors—a silicone-stamping technique is key to both processes.
Electronics makers have been trying to create flexible electronic screens for years, . . .
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