Stamping Electronics | December 18, 2006 Issue - Vol. 84 Issue 51 | Chemical & Engineering News
 
 
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Volume 84 Issue 51 | p. 12 | News of The Week
Issue Date: December 18, 2006

Stamping Electronics

Simple process could deliver next-generation electronics
Department: Science & Technology | Collection: Stimulus Funding

Two recent advances in device fabrication could help move transistors off silicon wafers and onto flexible plastic substrates. There, they could be made into bendable electronic paper and skin-conforming sensors.

Although the reports describe the fabrication of very different devices—one combines dissimilar classes of semiconductors, and the other consists of large arrays of single-crystal organic transistors—a silicone-stamping technique is key to both processes.

Electronics makers have been trying to create flexible electronic screens for years, . . .

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