CEN Webinars: Stronger Bonds
A Comparative Analysis of Semiconductor
Electroplating Bath Additives by CVS and HPLC
Tuesday June 17th 2014
11:00am EDT, 8:00am PDT, 16:00 BST
SPEAKERS
Speaker
Paul Voelker,
Vertical Marketing Manager,
Industrial & Environmental Markets
Thermo Fisher Scientific
 
Speaker
Marc Plante, Ph.D.,
Senior Applications Scientist
Thermo Fisher Scientific
 
Speaker
Stewart F. Fairlie,
Senior Process Engineer
Seagate Technologies
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OVERVIEW

Getting fast, accurate measurements on the performance of additives used in semiconductor electroplating baths is of critical importance in ensuring plating quality (uniformity, brightness, and consistency). Cyclic voltammetric stripping (CVS) is a widely used technique to measure the combined effect of additives and by-products on the plating quality of copper and nickel. However, CVS is not able to readily detect components individually, their by-products, or other compounds that are not electrochemically active. Liquid chromatography has been successfully applied to the determination of individual organic additives in acid copper and nickel plating baths.

With the use of faster and more accurate means of determination, products using metal-plated components can be produced with greater consistency and quality, while lowering operational costs, both in time and in materials: the method is relatively fast, requiring little time to operate than a CVS determination, and with a better control of the bath composition, greater operation time and less chemical waste can be realized.

This webinar will provide a comparative analysis of various additives, such as accelerators, levelers, and suppressors, using CVS and liquid chromatography using the Themo Scientific™ Dionex™ UltiMate™ HPLC systems with charged aerosol and electrochemical detectors.

KEY LEARNING OBJECTIVES

- The analytical techniques used for measuring accelerators, suppressors, and levelers in copper plating baths.

- Recognizing which by-products and contaminants that form in the plating bath signal the time for retiring the plating bath solution.

- Use of HPLC to determine saccharin and sodium dodecyl sulfate in nickel plating baths.

WHO SHOULD ATTEND
  • • Producers of integrated circuits, high-performance electronic components, products requiring highly controlled plating of copper or nickel.
  •  
  • • Users and suppliers of organic plating bath additives, including accelerator, suppressor, leveller, sodium dodecyl sulfate, saccharin, etc.
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SPONSOR
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MODERATOR
Speaker
Jeff Huber,
Associate Editor,
C&EN