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Nanomaterials

To shrink electronics further, innovative chemical deposition methods may save the day

Researchers experiment with area-selective atomic layer deposition to precisely place layers of conducting and insulating materials within circuits

by Mitch Jacoby
June 8, 2018 | A version of this story appeared in Volume 96, Issue 24
This photo shows three researchers in a Stanford University lab.

Credit: ZhiHua Chen | At Stanford University, Stacey F. Bent (from left), Dara Bobb-Semple, and Tzu-Ling Liu devise strategies for making ALD a spatially selective tool for growing thin films.

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