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Materials
BASF seals slurries deal
April 10, 2006
| A version of this story appeared in
Volume 84, Issue 15
BASF has entered a license and development agreement with TMP, a joint venture between the Japanese firms Toppan Printing and TDK, for chemical mechanical planarization (CMP) slurries. The partners are targeting slurries used to smooth copper and barrier layers in semiconductor wafer production. TMP already markets CMP slurries to customers in Japan; BASF has licensed TMP's technology and will manufacture slurries for customers outside of Japan.
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