Advertisement
Grab your lab coat. Let's get started
Welcome!
Welcome!
Create an account below to get 6 C&EN articles per month, receive newsletters and more - all free.
It seems this is your first time logging in online. Please enter the following information to continue.
As an ACS member you automatically get access to this site. All we need is few more details to create your reading experience.
Not you? Sign in with a different account.
Not you? Sign in with a different account.
ERROR 1
ERROR 1
ERROR 2
ERROR 2
ERROR 2
ERROR 2
ERROR 2
Password and Confirm password must match.
If you have an ACS member number, please enter it here so we can link this account to your membership. (optional)
ERROR 2
ACS values your privacy. By submitting your information, you are gaining access to C&EN and subscribing to our weekly newsletter. We use the information you provide to make your reading experience better, and we will never sell your data to third party members.
Materials
Rohm And Haas, IBM Link For Electronics
March 3, 2008
| A version of this story appeared in
Volume 86, Issue 9
Rohm and Haas has signed joint development agreements with IBM in two areas of semiconductor manufacturing. Under one pact, the firms will develop chemical mechanical planarization processes to make next-generation semiconductor wafers that feature 32-nm- and 22-nm-wide circuit lines. Rohm and Haas says it will target low-stress wafer polishing with new polishing pads and slurries. In the second deal, the companies will create new lithographic patterning materials for implanting ions during transistor fabrication.
You might also like...
The power is now in your (nitrile gloved) hands
Sign up for a free account to get more articles. Or choose the ACS option that’s right for you.
Already have an ACS ID? Log in
Join the conversation
Contact the reporter
Submit a Letter to the Editor for publication
Engage with us on Twitter