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Materials
BASF And IBM Claim New Plating Chemistry
by Michael McCoy
May 3, 2010
| A version of this story appeared in
Volume 88, Issue 18
BASF has created what it calls an advanced copper-plating chemistry for semiconductor manufacturing. The result of a joint development program started with IBM in 2007, the technology is set for commercialization later this year. BASF says the chemistry can be used to create copper circuits on chips with 32-nm wiring, the current state of the art, and on next-generation 22-nm chips.
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