Advertisement
Grab your lab coat. Let's get started
Welcome!
Welcome!
Create an account below to get 6 C&EN articles per month, receive newsletters and more - all free.
It seems this is your first time logging in online. Please enter the following information to continue.
As an ACS member you automatically get access to this site. All we need is few more details to create your reading experience.
Not you? Sign in with a different account.
Not you? Sign in with a different account.
ERROR 1
ERROR 1
ERROR 2
ERROR 2
ERROR 2
ERROR 2
ERROR 2
Password and Confirm password must match.
If you have an ACS member number, please enter it here so we can link this account to your membership. (optional)
ERROR 2
ACS values your privacy. By submitting your information, you are gaining access to C&EN and subscribing to our weekly newsletter. We use the information you provide to make your reading experience better, and we will never sell your data to third party members.
Materials
BASF And IBM Claim New Plating Chemistry
by Michael McCoy
May 3, 2010
| A version of this story appeared in
Volume 88, Issue 18
BASF has created what it calls an advanced copper-plating chemistry for semiconductor manufacturing. The result of a joint development program started with IBM in 2007, the technology is set for commercialization later this year. BASF says the chemistry can be used to create copper circuits on chips with 32-nm wiring, the current state of the art, and on next-generation 22-nm chips.
You might also like...
The power is now in your (nitrile gloved) hands
Sign up for a free account to get more articles. Or choose the ACS option that’s right for you.
Already have an ACS ID? Log in
Join the conversation
Contact the reporter
Submit a Letter to the Editor for publication
Engage with us on Twitter