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Materials

AZ Readies For Chip Self-Assembly

by Jean-François Tremblay
July 1, 2013 | APPEARED IN VOLUME 91, ISSUE 26

AZ Electronic Materials has opened a pilot plant in Wiesbaden, Germany, to make block copolymers for use in directed self-assembly of integrated circuits. Directed self-assembly is an emerging technology that allows manufacturers to produce chips with exceptionally fine circuitry once thought to be achievable only through extreme-ultraviolet photolithography (C&EN, April 15, page 12). Suppliers of semiconductor processing equipment have so far been unable to design reliable extreme-UV manufacturing tools, AZ notes.

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