Advertisement
Grab your lab coat. Let's get started
Welcome!
Welcome!
Create an account below to get 6 C&EN articles per month, receive newsletters and more - all free.
It seems this is your first time logging in online. Please enter the following information to continue.
As an ACS member you automatically get access to this site. All we need is few more details to create your reading experience.
Not you? Sign in with a different account.
Not you? Sign in with a different account.
ERROR 1
ERROR 1
ERROR 2
ERROR 2
ERROR 2
ERROR 2
ERROR 2
Password and Confirm password must match.
If you have an ACS member number, please enter it here so we can link this account to your membership. (optional)
ERROR 2
ACS values your privacy. By submitting your information, you are gaining access to C&EN and subscribing to our weekly newsletter. We use the information you provide to make your reading experience better, and we will never sell your data to third party members.
Materials
AZ Readies For Chip Self-Assembly
by Jean-François Tremblay
July 1, 2013
| A version of this story appeared in
Volume 91, Issue 26
AZ Electronic Materials has opened a pilot plant in Wiesbaden, Germany, to make block copolymers for use in directed self-assembly of integrated circuits. Directed self-assembly is an emerging technology that allows manufacturers to produce chips with exceptionally fine circuitry once thought to be achievable only through extreme-ultraviolet photolithography (C&EN, April 15, page 12). Suppliers of semiconductor processing equipment have so far been unable to design reliable extreme-UV manufacturing tools, AZ notes.
The power is now in your (nitrile gloved) hands
Sign up for a free account to get more articles. Or choose the ACS option that’s right for you.
Already have an ACS ID? Log in
Join the conversation
Contact the reporter
Submit a Letter to the Editor for publication
Engage with us on X