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Business

Extreme UV Spurs New Venture

by Jean-François Tremblay
May 18, 2015 | APPEARED IN VOLUME 93, ISSUE 20

Japan’s JSR and the European electronics research organization IMEC are forming a joint venture to develop photoresists suitable for use in extreme ultraviolet (EUV) lithography. Repeatedly delayed, EUV lithography is finally being deployed by chip makers. In April, ASML, a European semiconductor equipment firm, sold 15 EUV lithography systems. EUV is expected to enable semiconductor makers to make circuit lines measuring less than 10 nm.

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