Extreme UV Spurs New Venture | Chemical & Engineering News
Volume 93 Issue 20 | p. 17 | Concentrates
Issue Date: May 18, 2015

Extreme UV Spurs New Venture

Department: Business
Keywords: semiconductor, EUV, photoresists, lithography

Japan’s JSR and the European electronics research organization IMEC are forming a joint venture to develop photoresists suitable for use in extreme ultraviolet (EUV) lithography. Repeatedly delayed, EUV lithography is finally being deployed by chip makers. In April, ASML, a European semiconductor equipment firm, sold 15 EUV lithography systems. EUV is expected to enable semiconductor makers to make circuit lines measuring less than 10 nm.

 
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