Volume 93 Issue 27 | pp. 31-37
Issue Date: July 6, 2015

Electronic Chemical Makers Help Keep Gordon Moore’s Prediction Alive

Materials for photolithography, atomic layer deposition, and chemical mechanical planarization aid semiconductor miniaturization
Department: Business
News Channels: Materials SCENE, Nano SCENE
Keywords: photolithography, photoresist, EUV, immersion lithography, semiconductor, electronic materials, ASML, Imec, atomic layer deposition, organometallics, semiconductor, CMP, chemical mechanical planarization, polishing, semiconductor, wafer, electronic

Aeons from now, people might regard the semiconductors in our computers, phones, and flash drives the same way we now marvel at the Pyramid of Cheops: as wonders of precision and craftsmanship.

Bob Roberts, an industry veteran who works for Axus Technology and also consults for Techcet, tells people to imagine a 12-inch silicon wafer blown up to a mile in diameter. The wafer, at that scale, would be 13 feet thick. But . . .

To view the rest of this content, please log in with your ACS ID.

Chemical & Engineering News
ISSN 0009-2347
Copyright © American Chemical Society